For more information
To learn more about the Department of Mechanical Engineering at the University of South Carolina, call or mail us at:
The University of South Carolina
Department of Mechanical Engineering
300 Main Street
Columbia, SC 29208
Ph 803.777.4185
Fax 803.777.0106
Maps:
USC campus
Columbia, SC
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Chen Li
Assistant
Professor
Dr.
Li is
involved in the
development
and
fabrication
of
functionalized
structures/films
at micro/nanoscale;
The novel
applications
of these
micro/nano
structures
in renewable
energy
harvest and
storage,
enhancement
and
manipulation
of thermal
energy and
mass
transport at
micro/nano-scale,
and thermal
management
for high
heat flux
equipments/systems;
High spatial
and temporal
resolution
instrumentation
for
visualization
and
measurement
in study of
two-phase
heat
transfer and
flow;
Multi-scale
Modeling.
Education
-
Ph.D.,
Mechanical
Engineering,
Rensselaer
Polytechnic
Institute
2006
-
M.S.,
Mechanical
Engineering,
University
of
Nevada,
Reno,
2003
-
B.S.,
Thermal
Power
Engineering,
Chongqing
University,
China,
1997
Selected Publications
-
C.
Oshman,
B. Shi,
Chen Li,
R. G.
Yang, Y.
C. Lee,
and
V.M.
Bright,
“Fabrication
and
Testing
of a
Flat
Polymer
Micro
Heat
Pipe”,
to be
submitted
to IEEE/ASME
Journal
of
Micro-Electrical-Mechanical
Systems,
2009
-
Chen Li,
Z. Wang,
P.-I.
Wang, Y.
Peles,
G. P.
Peterson
and N.
Koratkar,
“Nanostructured
Copper
Interfaces
for
Enhanced
Boiling,”
Small,
Vol. 4,
No. 8,
pp.
1084-1088,
2008.
-
Chen Li
and G.
P.
Peterson,
“Parametric
Study of
Pool
Boiling
in
Horizontal
Conductive
Micro
Porous
Coated
Surfaces”
ASME
Journal
of Heat
Transfer.
Vol.
129, pp.
1465-1475.
2007.
-
Chen Li,
G. P.
Peterson,
and Y.
Wang,
“Evaporation/boiling
on Thin
Capillary
Wick
(I):
Thickness
Effects,”
ASME
Journal
of Heat
Transfer.
Vol.
128, pp.
1312-1319,
2006.
-
Chen Li
and
G. P.
Peterson,
“Evaporation/boiling
on Thin
Capillary
Wick
(II):
Effects
of
Volumetric
Porosity
and Mesh
Size,”
ASME
Journal
of Heat
Transfer.
Vol.
128, pp.
1320-1328.
2006.
-
Chen Li
and G.
P.
Peterson,
“The
Effective
Thermal
Conductivity
of
Sintered
Wire
Screen,”
Int. J.
Heat
Mass
Transfer,
Vol. 49,
pp.
4095-4105,
2006.
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