title  logo

Efficient Heat Transfer Solution

 

Enhanced Flow Boiling in Copper Nanowires Coated Microchannel

 

Removing high heat flux from a limited space is quite a big challenge for the thermal engineers and a major obstruction for further miniaturization and performance enhancement of electronics devices. Thermal engineers are searching different avenues for removing ultra high heat flux from a limited space keeping the heat sink small and investing less power. Micro-channel based two phase heat sink is a highly efficient way for that purpose, which already has attracted thermal researcher’s attention. Two phase flow in micro-channel is greatly influenced by the solid liquid interface characteristics. In this project, solid liquid interface has been modified by developing Cu nanowire on the solid surface to enhance the performance of the two phase heat sink. Experiments have been carried out in bottom-surface heated single micro-channel using DI water as coolant. From our preliminary investigation results, nanowire coating has been found effective in lowering the boiling incipience temperature, surface superheat temperature and in enhancing the boiling heat transfer rate.

sink
Heat sink SEM- CuNWs SEM-bare surface boiling-curve

The overall focus of this project is to reduce the heat sink size and surface super heat temperature by increasing the flow boiling heat transfer rate and reducing the boiling incipience temperature. This project is intended to have application in high heat flux electronics components.


Related Publications:
  1. Muhmmad Yakut Ali, Fanghao Yang, Ruixian Fang, Chen Li, Jamil Khan, “Thermohydraulic Characteristics Of A Single-Phase Microchannel Heat Sink Coated With Copper Nanowires”.Frontier of Heat and Mass Transfer (FHMT), Volume 2, No. 3, 033003, 2011.
  2. AKM M. Morshed, Fanghao yong, yakut Ali, Jamil A. Khan, Chen Li, “Enhanced flow boiling in a micro channel with integration of nanowires”, Applied Thermal Engineering, volume 32, January 2012, Pages 68-75.

for moreinformation: morshed@email.sc.edu

Funded by : ESRDC